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导热灌封胶
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AI AI Product Introduction
导热灌封胶专为电子元器件散热保护设计，双组份环氧树脂配方，导热系数0.8-3.0W/m·K，耐温范围-40℃至150℃，粘度500-2000cps，固化后硬度 Shore D 60-80。适用于LED驱动、电源模块、汽车电子等场景，提供优异的防水防尘和绝缘性能。建议按1:1比例混合，可室温或加热固化，操作时间30-60分钟。符合RoHS环保标准，包装为1kg/组或5kg/组，起订量10组。
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Product Details
导热灌封胶
发货地：深圳市
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导热灌封胶
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